Infineon Technologies has developed the world’s first 300 mm gallium nitride (GaN) wafer know-how, marking a major milestone within the energy semiconductor trade. By leveraging its present 300 mm silicon manufacturing infrastructure, Infineon has created a scalable, high-volume manufacturing course of that enhances cost-efficiency.
The 300 mm GaN wafers provide 2.3 instances extra chips per wafer in comparison with 200 mm wafers, bettering manufacturing effectivity and system efficiency. This innovation positions Infineon as a frontrunner within the quickly rising GaN market, which is projected to achieve a number of billion {dollars} by the tip of the last decade.
GaN-based energy semiconductors are gaining traction throughout numerous sectors, together with industrial, automotive, shopper electronics, AI energy provides, photo voltaic inverters, and motor-control programs. GaN know-how affords important benefits, akin to elevated power effectivity, diminished measurement and weight, and decrease general prices for finish customers. The brand new 300 mm GaN wafers guarantee larger provide stability and scalability, making them best for rising market calls for.
Infineon’s integration of 300 mm GaN wafers into its present silicon manufacturing strains in Villach, Austria, demonstrates the corporate’s experience in each GaN and silicon-based semiconductors. This breakthrough additionally paves the way in which for price parity between GaN and silicon, notably by way of comparable R DS(on) ranges. Infineon goals to showcase the primary 300 mm GaN wafers on the electronica trade show in November 2024 in Munich.
This development reinforces Infineon’s management in energy programs and its dedication to innovation, notably within the fields of decarbonization and digitalization. The corporate’s strategic deal with GaN, alongside silicon and silicon carbide, highlights its place on the forefront of semiconductor know-how.
Filed in Infineon and Semiconductors.
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